A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire pin is located within the through hole and a second portion of the wire pin is located within a retaining feature formed at least in part by the second component. The preferred method also includes moving one of the first and the second components in relation to the other of the first and the second components so that the wire pin resiliently deflects thereby establishing a first contact force between the first portion of the wire and the first component, and a second contact force between the second portion of the wire and the second component.