Invention Grant
- Patent Title: Prepreg and laminate
- Patent Title (中): 预浸料和层压板
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Application No.: US10626574Application Date: 2003-07-25
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Publication No.: US07056585B2Publication Date: 2006-06-06
- Inventor: Hiroyuki Mishima , Tsuyoshi Isozaki , Hidenori Kimbara , Norio Nagai
- Applicant: Hiroyuki Mishima , Tsuyoshi Isozaki , Hidenori Kimbara , Norio Nagai
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2002-216723 20020725
- Main IPC: C08K3/22
- IPC: C08K3/22
Abstract:
A prepreg comprising a thermosetting resin (D) composition containing, as an essential component, an aluminum hydroxide-boehmite composite (A) obtained by hydrothermal treatment of aluminum hydroxide, and a substrate (I), a laminate using the above prepreg, and a metal-foil-clad laminate using the above laminate.
Public/Granted literature
- US20040166324A1 Prepreg and laminate Public/Granted day:2004-08-26
Information query
