Invention Grant
- Patent Title: Workpiece processing and liquid droplet ejection inspection apparatus
- Patent Title (中): 工件加工液滴喷射检查装置
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Application No.: US10757358Application Date: 2004-01-14
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Publication No.: US07059705B2Publication Date: 2006-06-13
- Inventor: Yuji Iwata
- Applicant: Yuji Iwata
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2003-007511 20030115
- Main IPC: B41J23/00
- IPC: B41J23/00

Abstract:
An apparatus for inspecting drawing accuracy in a liquid droplet ejection apparatus performs drawing by ejecting a function liquid droplet while moving a function liquid droplet ejection head relative to a workpiece by using a moving mechanism. In response to the relative movement, a laser irradiating mechanism performs visually recognizable stippling on the workpiece by irradiating coherent light thereon. A control part drives the laser irradiating mechanism for stippling at a predetermined frequency timing.
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