Invention Grant
- Patent Title: Bonding pad and chip structure
- Patent Title (中): 接合垫和芯片结构
-
Application No.: US10711674Application Date: 2004-09-30
-
Publication No.: US07064449B2Publication Date: 2006-06-20
- Inventor: Chiu-Shun Lin , Kuan-Chou Lin , Chia-Hui Wu , Pai-Sheng Cheng
- Applicant: Chiu-Shun Lin , Kuan-Chou Lin , Chia-Hui Wu , Pai-Sheng Cheng
- Applicant Address: TW Tainan
- Assignee: Himax Technologies, Inc.
- Current Assignee: Himax Technologies, Inc.
- Current Assignee Address: TW Tainan
- Agency: Jiang Chyun IP Office
- Priority: TW93120184A 20040706
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A chip structure and a bonding pad are provided. The chip structure comprises a chip and at least a bonding pad. The chip has an active surface. The bonding pad is disposed on the active surface of the chip. The bonding pad comprises a polygonal body and a plurality of first protruding portions. The polygonal body has a first planar surface and a corresponding second planar surface. The second planar surface of the polygonal body is in contact with the chip. The first protruding portions are disposed on the first planar surface at the corner regions of the polygonal body. By modifying the geometric shape of the bonding pad, the yield of bonding the chip structure and another device together through the bonding pad is increased.
Public/Granted literature
- US20060006531A1 BONDING PAD AND CHIP STRUCTURE Public/Granted day:2006-01-12
Information query
IPC分类:
