Invention Grant
- Patent Title: Electronic device
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Application No.: US09880733Application Date: 2001-06-12
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Publication No.: US07075183B2Publication Date: 2006-07-11
- Inventor: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
- Applicant: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Townsend and Townsend and Crew LLP
- Priority: JP2000-180719 20000612; JP2000-396905 20001225
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
Public/Granted literature
- US20020171157A1 Electronic device Public/Granted day:2002-11-21
Information query
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