Invention Grant
- Patent Title: High-frequency module and method for manufacturing the same
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Application No.: US10098895Application Date: 2002-03-13
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Publication No.: US07081661B2Publication Date: 2006-07-25
- Inventor: Hideki Takehara , Noriyuki Yoshikawa , Kunihiko Kanazawa
- Applicant: Hideki Takehara , Noriyuki Yoshikawa , Kunihiko Kanazawa
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Hambre, Schumann, Mueller & Larson, P.C.
- Priority: JP2001-076373 20010316
- Main IPC: H01L31/00
- IPC: H01L31/00
Abstract:
In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.
Public/Granted literature
- US20020153582A1 High-frequency module and method for manufacturing the same Public/Granted day:2002-10-24
Information query
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