- Patent Title: Semiconductor device and method for producing the same by dicing
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Application No.: US10896042Application Date: 2004-07-22
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Publication No.: US07091109B2Publication Date: 2006-08-15
- Inventor: Tetsuo Fujii , Hiroshi Muto , Shinji Yoshihara , Sumitomo Inomata
- Applicant: Tetsuo Fujii , Hiroshi Muto , Shinji Yoshihara , Sumitomo Inomata
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP11-76566 19990319; JP11-196345 19990709
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/50
Abstract:
A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.
Public/Granted literature
- US20040259330A1 Semiconductor device and method for producing the same by dicing Public/Granted day:2004-12-23
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