Invention Grant
US07098149B2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure
有权
通过紫外线曝光机械增强致密和多孔有机硅酸盐材料
- Patent Title: Mechanical enhancement of dense and porous organosilicate materials by UV exposure
- Patent Title (中): 通过紫外线曝光机械增强致密和多孔有机硅酸盐材料
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Application No.: US10379466Application Date: 2003-03-04
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Publication No.: US07098149B2Publication Date: 2006-08-29
- Inventor: Aaron Scott Lukas , Mark Leonard O'Neill , Jean Louise Vincent , Raymond Nicholas Vrtis , Mark Daniel Bitner , Eugene Joseph Karwacki, Jr.
- Applicant: Aaron Scott Lukas , Mark Leonard O'Neill , Jean Louise Vincent , Raymond Nicholas Vrtis , Mark Daniel Bitner , Eugene Joseph Karwacki, Jr.
- Applicant Address: US PA Allentown
- Assignee: Air Products and Chemicals, Inc.
- Current Assignee: Air Products and Chemicals, Inc.
- Current Assignee Address: US PA Allentown
- Agent Rosaleen P. Morris-Oskanian
- Main IPC: H01L21/31
- IPC: H01L21/31
Abstract:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i.e., material hardness and elastic modulus) compared to the as-deposited film.
Public/Granted literature
- US20040175957A1 Mechanical enhancement of dense and porous organosilicate materials by UV exposure Public/Granted day:2004-09-09
Information query
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