Invention Grant
- Patent Title: Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk
- Patent Title (中): 用于消除串扰的多层印刷电路板中的差分对的布置
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Application No.: US10783596Application Date: 2004-02-19
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Publication No.: US07102455B2Publication Date: 2006-09-05
- Inventor: Yu Hsu Lin , Shang Tsang Yeh
- Applicant: Yu Hsu Lin , Shang Tsang Yeh
- Applicant Address: CN Shenzhen TW Taipei Hsien
- Assignee: Hon Fu Jin Precision Ind. (Shenzhen) Co., Ltd.,Hon Hai Percision Ind. Co., Ltd.
- Current Assignee: Hon Fu Jin Precision Ind. (Shenzhen) Co., Ltd.,Hon Hai Percision Ind. Co., Ltd.
- Current Assignee Address: CN Shenzhen TW Taipei Hsien
- Agent Wei Te Chung
- Priority: TW92131469A 20031111
- Main IPC: H01P3/02
- IPC: H01P3/02

Abstract:
An arrangement of differential pairs in a multi-layer printed circuit board is provided for eliminating crosstalk. The arrangement of differential pairs in the multi-layer printed circuit board includes a first differential pair, and a second differential pair. The first differential pair and the second differential pair may each be a driven pair or a victim pair. By properly arranging the first differential pair and the second differential pair, in accordance with the present invention, the resultant crosstalk on the first differential pair induced by the second differential pair, or vice versa, is substantially zero or negligible.
Public/Granted literature
- US20050099240A1 Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk Public/Granted day:2005-05-12
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