A printed circuit board for avoiding producing burrs, the printed circuit board includes a packaging substrate, at least one plated through hole, at least one first conductive portion, at least one non-conductive portion, at least one second conductive portion and at least one cut section. The plated through hole is formed on the packaging substrate. The first conductive portion and the second conductive portion respectively are adjacent to two sides of a peripheral of the plated through hole and separated by the non-conductive portion. Furthermore, the cut section is arranged on the non-conductive portion, thus the packaging substrate is cut without passing through the first conductive portion, and it will not cause the burrs on the first conductive portion.