Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
- Patent Title (中): 半导体装置及其制造方法，电路板和电子仪器
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Application No.: US10956050Application Date: 2004-10-04
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Publication No.: US07141873B2Publication Date: 2006-11-28
- Inventor: Akiyoshi Aoyagi
- Applicant: Akiyoshi Aoyagi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-351934 20031010
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A semiconductor device including: a semiconductor chip; a wiring board on which the semiconductor chip is mounted; and a plurality of external terminals provided on the wiring board. The external terminals include at least one first external terminal and two or more second external terminals. The first external terminal is formed of a soldering material. Each of the second external terminals includes a soldering material and a plurality of particles formed of a resin and dispersed in the soldering material. The second external terminals are a pair of external terminals among the external terminals, and a distance between the pair of external terminals is greater than a distance between any other pair of external terminals among the external terminals.
Public/Granted literature
- US20050098885A1 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument Public/Granted day:2005-05-12
Information query
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