Invention Grant
US07152313B2 Package substrate for integrated circuit and method of making the substrate
有权
用于集成电路的封装衬底和制造衬底的方法
- Patent Title: Package substrate for integrated circuit and method of making the substrate
- Patent Title (中): 用于集成电路的封装衬底和制造衬底的方法
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Application No.: US10723414Application Date: 2003-11-26
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Publication No.: US07152313B2Publication Date: 2006-12-26
- Inventor: Dustin P. Wood , Mark E. Thurston , Mahadevan Suryakumar
- Applicant: Dustin P. Wood , Mark E. Thurston , Mahadevan Suryakumar
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Buckley, Maschoff & Talwalkar LLC
- Main IPC: H05K3/38
- IPC: H05K3/38
Abstract:
In some embodiments, an article of manufacture includes a metal layer and a first dielectric layer in contact with a first face of the metal layer. The article of manufacture also includes a second dielectric layer in contact with a second face of the metal layer. The second face of the metal layer is opposite to the first face of the metal layer. The metal layer may be a continuous sheet having slots formed therein to allow the first and second dielectric layers to adhere to each other by way of the slots.
Public/Granted literature
- US20050111207A1 Package substrate for integrated circuit and method of making the substrate Public/Granted day:2005-05-26
Information query
