Invention Grant
- Patent Title: Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
- Patent Title (中): 电子元件安装结构，电子元件安装方法，电光装置和电子设备
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Application No.: US11216807Application Date: 2005-08-31
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Publication No.: US07161245B2Publication Date: 2007-01-09
- Inventor: Atsushi Saito
- Applicant: Atsushi Saito
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2004-274625 20040922
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An electronic component-mounted structure includes an electronic component having a bump electrode, the bump electrode including a projection made of a first resin and a conductive film covering at least a top of the projection; a substrate having a connecting terminal; and a second resin filling the space between the electronic component and the substrate, wherein the bump electrode abuts against the connecting terminal, and wherein the relationship T0
Public/Granted literature
Information query
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