Invention Grant
- Patent Title: Manufacturing method for multilayer ceramic elements
- Patent Title (中): 多层陶瓷元件的制造方法
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Application No.: US10348024Application Date: 2003-01-22
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Publication No.: US07162794B2Publication Date: 2007-01-16
- Inventor: Norio Sakai , Kazuhiro Iida
- Applicant: Norio Sakai , Kazuhiro Iida
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2000-058600 20000303
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.
Public/Granted literature
- US20030167629A1 Multilayer integrated substrate and manufacturing method for multilayer ceramic element Public/Granted day:2003-09-11
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