Invention Grant
US07163600B2 Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer 有权
通过该方法制备具有绝缘层的铜箔和具有绝缘层的铜箔的方法和使用具有绝缘层的铜箔的印刷线路板

  • Patent Title: Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer
  • Patent Title (中): 通过该方法制备具有绝缘层的铜箔和具有绝缘层的铜箔的方法和使用具有绝缘层的铜箔的印刷线路板
  • Application No.: US10250649
    Application Date: 2002-11-22
  • Publication No.: US07163600B2
    Publication Date: 2007-01-16
  • Inventor: Tetsuro SatoNoriyuki Nagashima
  • Applicant: Tetsuro SatoNoriyuki Nagashima
  • Applicant Address: JP Tokyo
  • Assignee: Mitsui Mining & Smelting Co., Ltd.
  • Current Assignee: Mitsui Mining & Smelting Co., Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
  • Priority: JP2001-359367 20011126; JP2002-190995 20020628; JP2002-326268 20021111
  • International Application: PCT/JP02/12221 WO 20021122
  • International Announcement: WO03/047323 WO 20030605
  • Main IPC: B32B37/00
  • IPC: B32B37/00
Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer
Abstract:
To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state is provided on one side surface of a copper foil 2; a nonwoven fabric 5 or a woven cloth 5 to be a skeletal component is press-bonded onto a first thermosetting resin layer 3; a second thermosetting resin layer 7 is formed on a surface of a press-bonded nonwoven fabric 5 or woven cloth 5; and a semi-cured insulating layer containing the nonwoven fabric 5 or the woven cloth 5 is formed on one side surface of the copper foil 2 by drying into a semi-cured state.”
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