Invention Grant
- Patent Title: Card manufacturing technique and resulting card
- Patent Title (中): 卡制造技术和结果卡
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Application No.: US10987626Application Date: 2004-11-12
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Publication No.: US07169640B2Publication Date: 2007-01-30
- Inventor: Robert F. Wallace
- Applicant: Robert F. Wallace
- Applicant Address: US CA Milpitas
- Assignee: SanDisk Corporation
- Current Assignee: SanDisk Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Parsons Hsue & de Runtz LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer extending to the edges of a circuit board for electrostatic discharge protection but also has gaps at the edge of the ground and/or power layer to avoid short circuiting with conductive segments of another layer deformed when the card is trimmed during manufacture.
Public/Granted literature
- US20050090038A1 Card manufacturing technique and resulting card Public/Granted day:2005-04-28
Information query
IPC分类:
