Invention Grant
- Patent Title: MEMS device polymer film deposition process
- Patent Title (中): MEMS器件聚合物膜沉积工艺
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Application No.: US10895477Application Date: 2004-07-21
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Publication No.: US07172978B2Publication Date: 2007-02-06
- Inventor: Hang Liao , Timothy Mellander , Mike Groh
- Applicant: Hang Liao , Timothy Mellander , Mike Groh
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469
Abstract:
A method of depositing polymer thin films on a MEMS device having a wafer stack includes depositing one or more protection films on a polymer thin film layer on the wafer stack, fabricating the MEMS device, and removing the one or more protection films.
Public/Granted literature
- US20060019420A1 MEMS device polymer film deposition process Public/Granted day:2006-01-26
Information query
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