Invention Grant
- Patent Title: Method for manufacturing MEMS structures
- Patent Title (中): 制造MEMS结构的方法
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Application No.: US10769346Application Date: 2004-01-30
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Publication No.: US07176047B2Publication Date: 2007-02-13
- Inventor: Ming-Chih Chang , H Shu Wu , Tsang-Mu Lai
- Applicant: Ming-Chih Chang , H Shu Wu , Tsang-Mu Lai
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Tung & Associates
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for forming a free standing micro-structural member including providing a substrate; blanket depositing a first sacrificial resist layer over the substrate; exposing and developing the first sacrificial resist layer to form a first resist portion; subjecting the first resist portion to at least a hard bake process to form the first resist portion having a predetermined first smaller volume compared to a desired final resist portion volume; blanket depositing at least a second sacrificial resist layer followed by exposure, development and the at least a hard bake process to form the final resist portion volume; and, depositing at least one structural material layer over the final resist portion.
Public/Granted literature
- US20050170544A1 Method for manufacturing MEMS structures Public/Granted day:2005-08-04
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