Invention Grant
- Patent Title: Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
- Patent Title (中): 用于形成凸块的方法，具有凸块的半导体元件及其制造方法，半导体器件及其制造方法，电路板和电子设备
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Application No.: US11191976Application Date: 2005-07-29
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Publication No.: US07176570B2Publication Date: 2007-02-13
- Inventor: Takuya Takahashi
- Applicant: Takuya Takahashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-041678 20020219
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous with the tip on the tip by using the tool. The wire is cut while leaving the bump on the electrode.
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