Invention Grant
- Patent Title: Method of making interlayer panels
- Patent Title (中): 制作夹层板的方法
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Application No.: US10718044Application Date: 2003-11-20
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Publication No.: US07178229B2Publication Date: 2007-02-20
- Inventor: William J. Borland , Saul Ferguson , Diptarka Majumdar , Matthew C. Snogren , Richard H. Snogren
- Applicant: William J. Borland , Saul Ferguson , Diptarka Majumdar , Matthew C. Snogren , Richard H. Snogren
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.
Public/Granted literature
- US20050111206A1 Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials Public/Granted day:2005-05-26
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