Invention Grant
US07193860B2 Leadframe-based module DC bus design to reduce module inductance
有权
基于引线框架的模块直流总线设计,减少模块电感
- Patent Title: Leadframe-based module DC bus design to reduce module inductance
- Patent Title (中): 基于引线框架的模块直流总线设计,减少模块电感
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Application No.: US11292870Application Date: 2005-12-02
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Publication No.: US07193860B2Publication Date: 2007-03-20
- Inventor: Scott Parkhill , Sayeed Ahmed , Fred Flett
- Applicant: Scott Parkhill , Sayeed Ahmed , Fred Flett
- Applicant Address: US MI Dearborn
- Assignee: Ballard Power Systems Corporation
- Current Assignee: Ballard Power Systems Corporation
- Current Assignee Address: US MI Dearborn
- Agency: Seed IP Law Group PLLC
- Main IPC: H01R9/00
- IPC: H01R9/00

Abstract:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Public/Granted literature
- US20060082983A1 Leadframe-based module DC bus design to reduce module inductance Public/Granted day:2006-04-20
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