Invention Grant
- Patent Title: Electrical circuit apparatus and method for assembling same
- Patent Title (中): 电路装置及其组装方法
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Application No.: US11180188Application Date: 2005-07-13
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Publication No.: US07195145B2Publication Date: 2007-03-27
- Inventor: John M. Waldvogel , Herman J. Miller
- Applicant: John M. Waldvogel , Herman J. Miller
- Applicant Address: US IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: US IL Schaumburg
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B21D39/00 ; H01L23/10 ; H01L23/34
Abstract:
A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
Public/Granted literature
- US20070012751A1 Electrical circuit apparatus and method for assembling same Public/Granted day:2007-01-18
Information query
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