Invention Grant
- Patent Title: Device and method for compensating defect in semiconductor memory
- Patent Title (中): 半导体存储器补偿缺陷的装置和方法
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Application No.: US11306381Application Date: 2005-12-27
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Publication No.: US07203107B2Publication Date: 2007-04-10
- Inventor: Jun-Lin Yeh
- Applicant: Jun-Lin Yeh
- Applicant Address: TW Hsinchu
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW93103144A 20040211
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C7/00

Abstract:
A device for compensating a semiconductor memory defect, suitable for use in a semiconductor memory, is provided. The device includes a memory array, having at least a defectless sub-memory region, the memory array being coupled to an address decoder circuit and a sensing circuit for storing data. A selection circuit is coupled to a control unit and outputs a selection signal to the control unit. A first input address buffer is coupled to the control unit and the address decoder circuit, and outputs an address signal to the address decoder circuit in response to the selection signal for selecting the defectless sub-memory region to store data. A method for compensating a semiconductor memory defect is also provided, including determining whether the memory region of the semiconductor memory has a defect; and replacing the memory region with the defectless sub-memory region to store data when the semiconductor memory is defective.
Public/Granted literature
- US20060203579A1 DEVICE AND METHOD FOR COMPENSATING DEFECT IN SEMICONDUCTOR MEMORY Public/Granted day:2006-09-14
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