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US07261919B2 Silicon carbide and other films and method of deposition 有权
碳化硅等薄膜及沉积方法

Silicon carbide and other films and method of deposition
Abstract:
A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.
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