Invention Grant
- Patent Title: Semiconductor device including inclined cut surface and manufacturing method thereof
- Patent Title (中): 包括倾斜切割面的半导体装置及其制造方法
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Application No.: US10892483Application Date: 2004-07-16
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Publication No.: US07264997B2Publication Date: 2007-09-04
- Inventor: Koujiro Kameyama , Kiyoshi Mita
- Applicant: Koujiro Kameyama , Kiyoshi Mita
- Applicant Address: JP Osaka JP Gunma
- Assignee: Sanyo Electric Co., Ltd.,Kanto Sanyo Semiconductors Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.,Kanto Sanyo Semiconductors Co., Ltd.
- Current Assignee Address: JP Osaka JP Gunma
- Agency: Fish & Richardson P.C.
- Priority: JP2003-197860 20030716
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.
Public/Granted literature
- US20050012187A1 Semiconductor device and its manufacturing method Public/Granted day:2005-01-20
Information query
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