Invention Grant
- Patent Title: Fin for a heat sink, heat sink and method for manufacturing a heat sink
- Patent Title (中): 散热片，散热片和制造散热片的方法
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Application No.: US11492093Application Date: 2006-07-25
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Publication No.: US07267167B2Publication Date: 2007-09-11
- Inventor: Phon Quan Lee
- Applicant: Phon Quan Lee
- Applicant Address: TW
- Assignee: Cooler Master Co., Ltd
- Current Assignee: Cooler Master Co., Ltd
- Current Assignee Address: TW
- Agency: Hershkovitz & Associates
- Agent Abe Hershkovitz
- Priority: TW94128008A 20050817
- Main IPC: F28F1/30
- IPC: F28F1/30
Abstract:
A method for manufacturing a heat sink has steps of providing multiple fins and a heat pipe, assembling the fins, mounting a thermal-conductive medium, attaching the heat pipe, heating the thermal-conductive medium, rotating the fins and cooling the thermal-conductive medium. Because the thermal-conductive medium is inserted in the cavities in the fins before the heat pipe extends through the fins, inserting the thermal-conductive medium is easy and convenient.
Public/Granted literature
- US20070039726A1 Fin for a heat sink, heat sink and method for manufacturing a heat sink Public/Granted day:2007-02-22
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