A gas sensor module for the spectroscopic measurement of at least one gas concentration, including at least: a spectroscopic gas sensor having a sensor chip which has a micropatterned measuring structure, and having an IR-transparent cap chip covering the measuring structure; a premolded package having a package bottom and a package edge to which a cover having a screen opening provided above the measuring structure is attached; a filter chip provided between the cover and the cap chip; and a lead frame which is partially injected into the premolded package and has multiple leads that include connecting pins for contacting a substrate and contact pads which contact the contact pads of the gas sensor, the connecting pins being bent upward from the package edge. The gas sensor module is mountable by its connecting pins to a substrate in such a way that the measuring structure having the filter chip is positioned directly opposite a substrate opening. Compact dimensions of the finished sensor unit are achieved, while minimizing the production time and ensuring a high degree of radiation shielding.