Invention Grant
- Patent Title: Housing of circuit boards
- Patent Title (中): 电路板外壳
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Application No.: US11479474Application Date: 2006-06-30
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Publication No.: US07293999B2Publication Date: 2007-11-13
- Inventor: Keith Everett , Kevin Paul Little , Jamie Anderson
- Applicant: Keith Everett , Kevin Paul Little , Jamie Anderson
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Priority: GB0513956.3 20050707
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A fiber optic module has a PCB with high frequency tracks. The PCB is housed within a housing having top and bottom parts, each having a series of metallized ridges. The PBC has through holes filled with solder. Thus, there is a series of electrical interconnections through the PBC, and the total length of any enclosed periphery is much shorter than the full periphery of the board so that high frequencies are attenuated.
Public/Granted literature
- US20070020971A1 Housing of circuit boards Public/Granted day:2007-01-25
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