Invention Grant
- Patent Title: Method for improving the thermal cycled adhesion of thick-film conductors on dielectric
- Patent Title (中): 改善电介质厚膜导体热循环粘附性的方法
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Application No.: US11111317Application Date: 2005-04-21
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Publication No.: US07294390B2Publication Date: 2007-11-13
- Inventor: Bradley H. Carter , Lynda G. Flederbach , John K. Isenberg
- Applicant: Bradley H. Carter , Lynda G. Flederbach , John K. Isenberg
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Jimmy L. Funke
- Main IPC: B32B3/00
- IPC: B32B3/00 ; H05K1/00
Abstract:
An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to achieve enhanced adhesion with the substrate, and a second film that is applied over the first film using an ink that has been specifically formulated to achieve enhanced solderability.
Public/Granted literature
- US20060240231A1 Method for improving the thermal cycled adhesion of thick-film conductors on dielectric Public/Granted day:2006-10-26
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