Invention Grant
- Patent Title: Sheet material and wiring board
- Patent Title (中): 板材和接线板
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Application No.: US11167623Application Date: 2005-06-27
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Publication No.: US07294393B2Publication Date: 2007-11-13
- Inventor: Hideya Murai , Tadanori Shimoto , Kazuhiro Baba , Katsumi Kikuchi
- Applicant: Hideya Murai , Tadanori Shimoto , Kazuhiro Baba , Katsumi Kikuchi
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Katten Muchin Rosenman LLP
- Priority: JP2002-380631 20021227
- Main IPC: B32B3/06
- IPC: B32B3/06

Abstract:
In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength layer (3) is made of polyimide, which is not softened at a thermosetting temperature of the epoxy resin and has a tensile rupture strength higher than that of the cured thermosetting material. Moreover, the polyimide has a tensile rupture strength of 100 MPa or higher at 23° C. and a tensile rupture elongation of 10% or higher at 23° C. Assuming that a tensile rupture strength at −65° C. is a and a tensile rupture strength at 150° C. is b, a ratio (a/b) is 2.5 or less.
Public/Granted literature
- US20050281995A1 Sheet material and wiring board Public/Granted day:2005-12-22
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