Invention Grant
US07300972B2 Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate 有权
水溶性聚酰亚胺前体,聚酰亚胺前体溶液,聚酰亚胺,具有聚酰亚胺粘结剂的浸渍材料和层压材料

  • Patent Title: Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate
  • Patent Title (中): 水溶性聚酰亚胺前体,聚酰亚胺前体溶液,聚酰亚胺,具有聚酰亚胺粘结剂的浸渍材料和层压材料
  • Application No.: US11253599
    Application Date: 2005-10-20
  • Publication No.: US07300972B2
    Publication Date: 2007-11-27
  • Inventor: Hideki OzawaFumio Aoki
  • Applicant: Hideki OzawaFumio Aoki
  • Applicant Address: JP Yamaguchi-ken
  • Assignee: Ube Industries Ltd.
  • Current Assignee: Ube Industries Ltd.
  • Current Assignee Address: JP Yamaguchi-ken
  • Agency: Morgan, Lewis & Bockius LLP
  • Priority: JP2001-27780 20010205; JP2001-385181 20011218
  • Main IPC: C08L79/08
  • IPC: C08L79/08
Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate
Abstract:
A water-soluble polyimide precursor, which can be suitably applied for aromatic polyimides and exhibits a low reduction in heat resistance and mechanical properties, an aqueous solution of the polyimide precursor and a polyimide obtained from the precursor. A heat-resistant fiber impregnated material and an impregnated sheet-like material are prepared by using the precursor and a laminate is prepared by employing the precursor.
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