Invention Grant
- Patent Title: Electronic device having wiring substrate and lead frame
- Patent Title (中): 具有布线基板和引线框架的电子设备
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Application No.: US11034139Application Date: 2005-01-13
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Publication No.: US07304370B2Publication Date: 2007-12-04
- Inventor: Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
- Applicant: Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2004-006684 20040114; JP2004-301406 20041015
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/02
Abstract:
An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.
Public/Granted literature
- US20050151229A1 Electronic device having wiring substrate and lead frame Public/Granted day:2005-07-14
Information query
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