Invention Grant
- Patent Title: Wired circuit board assembly
- Patent Title (中): 有线电路板组装
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Application No.: US11342215Application Date: 2006-01-30
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Publication No.: US07307853B2Publication Date: 2007-12-11
- Inventor: Yasuhito Funada , Yoshihiko Takeuchi , Hitoki Kanagawa , Tetsuya Ohsawa
- Applicant: Yasuhito Funada , Yoshihiko Takeuchi , Hitoki Kanagawa , Tetsuya Ohsawa
- Applicant Address: JP
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP
- Agency: Akerman Senterfitt
- Agent Jean C. Edwards, Esq.
- Priority: JP2005-024009 20050131
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10

Abstract:
There is provided a wired circuit board assembly that prevents breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet, a plurality of wired circuit boards include a base insulating layer, a conductor pattern, and a cover insulating layer which are formed on a support board are supported by a support frame in such a manner that they are arranged and aligned in mutually spaced relation. Each of the wired circuit boards has a flexing portion formed by removing the support board to obtain a flexing property. In addition, second connecting portions are provided in spanning relation between the flexing portion and the vertical frame parts of the support frame.
Public/Granted literature
- US20060169486A1 Wired circuit board assembly Public/Granted day:2006-08-03
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