Invention Grant
US07309447B2 Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
有权
使用预先图案化的可再利用模具制造微电子封装的方法和用于制造模具的方法
- Patent Title: Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
- Patent Title (中): 使用预先图案化的可再利用模具制造微电子封装的方法和用于制造模具的方法
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Application No.: US10771252Application Date: 2004-02-03
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Publication No.: US07309447B2Publication Date: 2007-12-18
- Inventor: David Light , Masud Beroz
- Applicant: David Light , Masud Beroz
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: B44C1/22
- IPC: B44C1/22
Abstract:
A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.
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