A circuit component mounting device includes a resin substrate, vias, a circuit component composed of a main body and electrode portions, a solder, and an insulative sealing resin that covers the circuit component and the solder. The device further includes a base metal pattern which covers parts of the principal face of the resin substrate where the vias are exposed and is composed of a Cu layer and a Ni layer and a copper plated pattern which is provided on the base metal pattern and is composed of a Cu layer, a Ni layer, and an Au layer. The circuit component is provided on the copper plated pattern. The solder allows the copper plated pattern and the circuit component to adhere to each other.