Invention Grant
- Patent Title: Apparatus and method for transferring heat from processors
- Patent Title (中): 用于从处理器传送热量的装置和方法
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Application No.: US10999725Application Date: 2004-11-30
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Publication No.: US07312992B2Publication Date: 2007-12-25
- Inventor: Edward M. Jory , David S. Slaton
- Applicant: Edward M. Jory , David S. Slaton
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Cantor Colburn LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat exchange apparatus having a housing that includes a first region and a second region, and a wall separating the first region from the second region, is disclosed. The second region includes a fluid flow entry port and a fluid flow exit port to define a fluid flow path, and a heat exchanger exposed to the fluid flow path. The heat exchanger includes first and second portions in thermal communication with each other, where the first portion is disposed at the first region and the second portion is disposed at the second region. The fluid flow path is isolated from the first region and provides for the removal of heat from the first region.
Public/Granted literature
- US20060114652A1 Apparatus and method for transferring heat from processors Public/Granted day:2006-06-01
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