Invention Grant
- Patent Title: Method and apparatus for inspection of semiconductor devices
- Patent Title (中): 用于半导体器件检查的方法和装置
-
Application No.: US11348029Application Date: 2006-02-06
-
Publication No.: US07326929B2Publication Date: 2008-02-05
- Inventor: Mau-Song Chou , Jonathan W. Arenberg , Mark A. Menard , Thomas T. Chung
- Applicant: Mau-Song Chou , Jonathan W. Arenberg , Mark A. Menard , Thomas T. Chung
- Applicant Address: US CA Los Angeles
- Assignee: Northrop Grumman Corporation
- Current Assignee: Northrop Grumman Corporation
- Current Assignee Address: US CA Los Angeles
- Agency: Carmen B. Patti & Assoc., LLC
- Main IPC: G02F1/01
- IPC: G02F1/01

Abstract:
A technique for providing high-contrast images of defects in semiconductor devices and arrays of such devices, by illuminating each semiconductor device under inspection with broadband infrared radiation, and then forming an image of radiation that is specularly reflected from the semiconductor device. Many semiconductor devices and arrays of such devices have a metal backing layer that specularly reflects the illumination back into an appropriately positioned and aligned camera, selected to be sensitive to infrared wavelengths at which the semiconductor device materials are relatively transparent.
Public/Granted literature
- US20070181809A1 Method and apparatus for inspection of semiconductor devices Public/Granted day:2007-08-09
Information query