Invention Grant
- Patent Title: Method for protecting encapsulated sensor structures using stack packaging
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Application No.: US10404567Application Date: 2003-03-31
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Publication No.: US07335971B2Publication Date: 2008-02-26
- Inventor: Karsten Funk
- Applicant: Karsten Funk
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the micro-mechanical sensor chip is arranged so that a surface of the protective membrane faces toward a second chip, and the micro-mechanical sensor chip is secured to the second chip.
Public/Granted literature
- US20040197953A1 Method for protecting encapsulated sensor structures using stack packaging Public/Granted day:2004-10-07
Information query
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