Invention Grant
- Patent Title: Method for manufacturing metal microstructure
- Patent Title (中): 制造金属微观结构的方法
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Application No.: US11503303Application Date: 2006-08-14
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Publication No.: US07338753B2Publication Date: 2008-03-04
- Inventor: Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
- Applicant: Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2001-330652 20011029; JP2002-295077 20021008
- Main IPC: G03F7/039
- IPC: G03F7/039

Abstract:
A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.
Public/Granted literature
- US20060276044A1 Method for manufacturing metal microstructure Public/Granted day:2006-12-07
Information query
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