Invention Grant
- Patent Title: Tungsten metal removing solution and method for removing tungsten metal by use thereof
- Patent Title (中): 钨金属去除溶液及其使用方法
-
Application No.: US11001684Application Date: 2004-12-01
-
Publication No.: US07351354B2Publication Date: 2008-04-01
- Inventor: Toshikazu Shimizu , Kaori Watanabe , Hidemitsu Aoki
- Applicant: Toshikazu Shimizu , Kaori Watanabe , Hidemitsu Aoki
- Applicant Address: JP Kawasaki, Kanagawa
- Assignee: Kanto Kagaku Kabushiki Kaisha
- Current Assignee: Kanto Kagaku Kabushiki Kaisha
- Current Assignee Address: JP Kawasaki, Kanagawa
- Agency: Lowrie, Lando & Anastasi, LLP
- Priority: JP2003-403240 20031202
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
A removing solution for removing tungsten metal which causes a film formation on a semiconductor substrate or adheres to it, wherein orthoperiodic acid and water are contained.
Public/Granted literature
- US20050156140A1 Tungsten metal removing solution and method for removing tungsten metal by use thereof Public/Granted day:2005-07-21
Information query
IPC分类:
