Invention Grant
- Patent Title: Method of manufacturing coreless substrate
- Patent Title (中): 无芯基板的制造方法
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Application No.: US11379059Application Date: 2006-04-18
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Publication No.: US07353591B2Publication Date: 2008-04-08
- Inventor: Tso-Hung Yeh
- Applicant: Tso-Hung Yeh
- Applicant Address: TW Taoyuan
- Assignee: Kinsus Interconnect Technology Corp.
- Current Assignee: Kinsus Interconnect Technology Corp.
- Current Assignee Address: TW Taoyuan
- Main IPC: H05K3/36
- IPC: H05K3/36

Abstract:
A method for manufacturing coreless substrates is provided herein. The method first provides a base whose top and bottom sides are covered with metal layers respectively that are detachable from the base. From the two metal layers, the method then develops the bump-pad side or ball side wiring layers required by the coreless substrate simultaneously. The two metal layers along with their respective wiring layers are then separated from the base into two independent semi-products of the coreless substrate. The method then develops from the other sides of the two semi-products the laminate side wiring layers required by the coreless substrate.
Public/Granted literature
- US20070245551A1 Method Of Manufacturing Coreless Substrate Public/Granted day:2007-10-25
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