Invention Grant
US07355862B2 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
有权
印刷电路板，制造印刷电路板的方法，引线框架封装和光学模块
- Patent Title: Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
- Patent Title (中): 印刷电路板，制造印刷电路板的方法，引线框架封装和光学模块
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Application No.: US11109656Application Date: 2005-04-20
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Publication No.: US07355862B2Publication Date: 2008-04-08
- Inventor: Takehiro Shirai , Masayuki Iwase
- Applicant: Takehiro Shirai , Masayuki Iwase
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2003-065475 20030311
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10
Abstract:
A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.
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