Invention Grant
- Patent Title: Solid solution wide bandgap semiconductor materials
- Patent Title (中): 固溶体宽带隙半导体材料
-
Application No.: US11484691Application Date: 2006-07-12
-
Publication No.: US07371282B2Publication Date: 2008-05-13
- Inventor: Narsingh Bahadur Singh , Brian Wagner , Mike Aumer , Darren Thomson , David Kahler , Andre Berghmans , David J. Knuteson
- Applicant: Narsingh Bahadur Singh , Brian Wagner , Mike Aumer , Darren Thomson , David Kahler , Andre Berghmans , David J. Knuteson
- Applicant Address: US CA Los Angeles
- Assignee: Northrop Grumman Corporation
- Current Assignee: Northrop Grumman Corporation
- Current Assignee Address: US CA Los Angeles
- Agency: Andrews Kurth LLP
- Main IPC: C30B25/12
- IPC: C30B25/12 ; C30B25/14

Abstract:
A substrate and method for growing a semi-conductive crystal on an alloy film such as (AIN)x(SiC)(1-x) without any buffer layer is disclosed. The (AIN)x(SiC)(1-x) alloy film can be formed on a SiC substrate by a vapor deposition process using AlN and SiC powder as starting materials. The (AIN)x(SiC)(1-x) alloy film provides a better lattice match for GaN or SiC epitaxial growth and reduces defects in epitaxially grown GaN with better lattice match and chemistry.
Public/Granted literature
- US20080011223A1 Solid solution wide bandgap semiconductor materials Public/Granted day:2008-01-17
Information query
IPC分类: