Invention Grant
- Patent Title: Flip-chip adaptor package for bare die
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Application No.: US11437550Application Date: 2006-05-19
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Publication No.: US07381591B2Publication Date: 2008-06-03
- Inventor: Walter L. Moden
- Applicant: Walter L. Moden
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.
Public/Granted literature
- US20060211174A1 Flip-chip adaptor package for bare die Public/Granted day:2006-09-21
Information query
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