Invention Grant
- Patent Title: Printed circuit board and inspection method therefor
- Patent Title (中): 印刷电路板及其检验方法
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Application No.: US11208884Application Date: 2005-08-23
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Publication No.: US07381903B2Publication Date: 2008-06-03
- Inventor: Kunihiko Azeyanagi , Hideya Yoshikawa , Hiroaki Inose
- Applicant: Kunihiko Azeyanagi , Hideya Yoshikawa , Hiroaki Inose
- Applicant Address: JP Tokyo-To
- Assignee: Nippon Mektron, Ltd.
- Current Assignee: Nippon Mektron, Ltd.
- Current Assignee Address: JP Tokyo-To
- Agency: Jacobson Holman PLLC
- Priority: JP2004-248835 20040827
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/09

Abstract:
It is an object of the present invention to provide a printed circuit board and an inspection method therefor capable of electrically inspecting misregistration of a solder resist and a display by silk printing with respect to a wiring pattern on a printed circuit board. The present invention provides a printed circuit board provided with a conductive layer for electromagnetic shielding including at least two targets 11, 12 formed as conductive patterns of the same shape on the printed circuit board, insulating layers 21, 22, 23, 4 greater than the targets and analogous to the targets provided in such a way as to be overlaid on the targets and an electromagnetic shielding layer 3 provided on the insulating layers, and an inspection method using the printed circuit board.
Public/Granted literature
- US20060042822A1 Printed circuit board and inspection method therefor Public/Granted day:2006-03-02
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