A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the first holes; grinding the conductive layer such that the portion of the conductive layer remains in the first holes to form a pattern of conductive traces; forming a dielectric protective layer that covers the insulating layer and the conductive traces; forming a pattern of second holes in the protective layer such that a portion of each of the conductive traces is accessible through a respective one of the second holes; and forming conductive bumps that are respectively connected to the conductive traces.