Invention Grant
US07383977B2 Method for attaching a shield can to a PCB and a shield can therefor
有权
用于将屏蔽罩附接到PCB和屏蔽件的方法
- Patent Title: Method for attaching a shield can to a PCB and a shield can therefor
- Patent Title (中): 用于将屏蔽罩附接到PCB和屏蔽件的方法
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Application No.: US10512012Application Date: 2003-03-31
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Publication No.: US07383977B2Publication Date: 2008-06-10
- Inventor: Gustav Fagrenius , Fredrik Palmqvist
- Applicant: Gustav Fagrenius , Fredrik Palmqvist
- Applicant Address: SE Lund
- Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee Address: SE Lund
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP02388032 20020430
- International Application: PCT/EP03/03356 WO 20030331
- International Announcement: WO03/094588 WO 20031113
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K31/02 ; H05K9/00
Abstract:
A method for providing a PCB (printed circuit board) with a shield can (1) comprising a metal shell with a free rim (5). The method prescribes that the rim (5) of the shield can (1) is provided with an extra amount of solder (8) before the shield can (1) is placed on the PCB. A shield can (1) is also described.
Public/Granted literature
- US20050254224A1 Method for attaching a shield can to a pcb and a shield can therefor Public/Granted day:2005-11-17
Information query
IPC分类:
