Invention Grant
- Patent Title: Method of manufacturing a LIGA mold by backside exposure
- Patent Title (中): 通过背面曝光制造LIGA模具的方法
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Application No.: US11446111Application Date: 2006-06-05
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Publication No.: US07384729B2Publication Date: 2008-06-10
- Inventor: Chien-Chung Fu , Heng-Chi Huang
- Applicant: Chien-Chung Fu , Heng-Chi Huang
- Applicant Address: TW Hsinchu
- Assignee: National Tsing Hua University
- Current Assignee: National Tsing Hua University
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW94118691A 20050607
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A mold manufacturing method includes the steps of: disposing a mask layer on a front side and a backside of a first substrate, wherein the first substrate is transparent to a predetermined light source and the mask layer has a top portion and a bottom portion, which are respectively disposed on the front side and the backside and arranged alternately; forming a photoresist layer on the front side of the first substrate; providing the predetermined light source to illuminate the backside of the first substrate so as to expose the photoresist layer to form an exposed portion and an unexposed portion; and removing the unexposed portion to form a patterned structure having trenches and micro-holes arranged alternately; forming a metal layer on the patterned structure of the photoresist layer and the first substrate; and removing the photoresist layer and the first substrate; to remain the metal layer.
Public/Granted literature
- US20060275711A1 Method of manufacturing a LIGA mold by backside exposure Public/Granted day:2006-12-07
Information query
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