Invention Grant
- Patent Title: BGA package substrate and method of fabricating same
- Patent Title (中): BGA封装基板及其制造方法
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Application No.: US11086625Application Date: 2005-03-22
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Publication No.: US07387917B2Publication Date: 2008-06-17
- Inventor: Jae Min Choi , Young Hwan Shin
- Applicant: Jae Min Choi , Young Hwan Shin
- Applicant Address: KR Kyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Kyunggi-Do
- Agency: Darby & Darby P.C.
- Priority: KR10-2004-0116798 20041230
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same.
Public/Granted literature
- US20060145345A1 BGA package substrate and method of fabricating same Public/Granted day:2006-07-06
Information query
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