Invention Grant
- Patent Title: Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same
- Patent Title (中): 线圈导体，层叠线圈导体，其制造方法及使用其的电子部件
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Application No.: US11017884Application Date: 2004-12-22
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Publication No.: US07394341B2Publication Date: 2008-07-01
- Inventor: Koji Shimoyama , Nobuya Matsutani , Yuji Mido , Michio Ohba , Akihiko Ibata
- Applicant: Koji Shimoyama , Nobuya Matsutani , Yuji Mido , Michio Ohba , Akihiko Ibata
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2003-433144 20031226
- Main IPC: H01F5/00
- IPC: H01F5/00
Abstract:
A coil electric conductor has an insulating substrate, a first conductive layer, and a second conductive layer. The first conductive layer is formed at a depression provided on a face of the insulating substrate. The second conductive layer is formed on the first conductive layer with the first conductive layer interposed between the second conductive layer and the insulating substrate. This construction realizes a coil electric conductor having a highly precisely uniformized cross-sectional shape.
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